Fast Technology November 11 news, according to reports, Wei Zhejia, CEO of TSMC, recently revealed that customers inquiring enthusiasm for 2nm (NM) technology exceeds 3 nanometers, indicating that 2nm technology is even more affected by 2nm technology. The market is favored, and TSMC can achieve a sustainable and stable growth trend in the next five years.
The industry dynamics pointed out that it is restricted by regulatory policies, although TSM However, it is impossible to move to overseas production bases.This restriction stems from local legal protection measures to prevent core technology outflow.
TSMC clearly stated that if its overseas factory is involved in the production of 2nm chips, it still takes several years of preparation and planning to ensure that the worlds leading craft technology is retained in the country.
Specific to the layout of TSMC in Arizona, USA, the first wafer fab is steadily promoted. It is expected to be officially put into production in early 2025. To 30,000 pieces, it marks the milestone of TSMCs overseas advanced process.
Then, the second wafer fab will adopt a 3nm process with a planned monthly production capacity of 25,000 pieces. It is expected that the total monthly production capacity of the two factories will rise to 60,000 pieces by 2028.As for the third wafer factory, it is aimed at 2nm or more advanced technical nodes, and it is planned to complete the construction by 2030.This series of layout not only highlights TSMCs leadership in the global semiconductor industry, but also lays a solid foundation for its long -term development.
