This article is comprehensive by the semiconductor industry (ID: ICVIEWS)
Although TSMC is actively actively in the United States , Europe and Japans layout construction adopt advanced process technology wafers, its core cutting -edge semiconductor production technology cannot be migrated to overseas production bases.
Wei Zhejia, CEO of TSMC, recently revealed that customers inquiring enthusiasm for 2nm (NM) technology exceeds 3 nanometers, indicating that 2nm technology is more popular in the market. And look forward to the continuous and stable growth trend in TSMC in the next five years.
The industry dynamics pointed out that it is restricted by regulatory policies, although TSM However, it is impossible to move to overseas production bases.This restriction stems from local legal protection measures to prevent core technology outflow.
TSMC clearly stated that if its overseas factory is involved in the production of 2nm chips, it still takes several years of preparation and planning to ensure that the worlds leading craft technology is retained in the country.
Specific to the layout of TSMC in Arizona, the first wafer factory in Arizona, the first wafer fab is steadily promoted. It is expected to be officially put into production in early 2025. To 30,000 pieces, it marks the milestone of TSMCs overseas advanced process.
Then, the second wafer fab will adopt a 3mm process with a planned monthly production capacity of 25,000 pieces. It is expected that the total monthly production capacity of the two factories will rise to 60,000 pieces by 2028.As for the third wafer factory, it is aimed at 2nm or more advanced technical nodes, and it is planned to complete the construction by 2030.This series of layout not only highlights TSMCs leadership in the global semiconductor industry, but also lays a solid foundation for its long -term development.
The latest news shows that TSMC will begin production in the fourth quarter of 2025 in the FAB 20 factory in Hsinchu 20 in Hsinchu. Kaohsiungs FAB 22 plant will also begin production with a production capacity of 30K WPM and is expected to begin production in the first quarter of 2026.
N2P will begin production at the end of 2026, but there will be no back power transmission announced by the previous announcement.TSMC CEO Wei Zhejia said that the planning capacity of the 2NM process has exceeded 3mm processes.It is reported that the cost of 2nm wafers will reach more than 30,000 US dollars.Both N2 and N2P will use TSMCs NANOFLEX technology. This technology allows chip designers to mix and match units with different libraries (high performance, low power consumption, and high -efficiency) units in the same design.
N2 is 15%higher than N3E, and the performance at the same power increases by 10%to 15%than N3E, or reduces power consumption at the same frequency and complexity by 25%to 30% EssenceFollowing N2E, N2P and voltage enhanced N2X will be launched in 2026.
2NM chip is the most advanced chip at the moment. TSMC is expected to mass production in 2025.Compared with the currently most advanced 7 -nano -node chip, the 2nm chip technology is expected to increase the performance of the chip by 45%and reduce energy consumption by 75%.This means that while maintaining the same performance, the 2 -nanometer chip can significantly reduce energy consumption, which is of great significance for improving the battery life of the equipment and reducing the energy use of data centers.
TSMC 2nm has been risky trial production to ensure that it can have a stable yield before mass production.As early as December last year, TSMC has demonstrated the test results of the 2 -nanometer technology prototype to Apple and Huida.For the progress of the 2 -nanometer trial production, TSMC stated that the 2 -nanometer process technology is planned as scheduled.The construction projects of the wafer fabry in Kaohsiung and Arizona in the United States are carried out in accordance with the plan and progress well.
According to the latest report of Morgan Stanley, TSMCs monthly production capacity will increase from the 10,000 test production scale this year to about 50,000 pieces next year.By 2026, Apple iPhone 18 built -in A20 chips will use 2 nanometers to mass production, and monthly production capacity will reach 80,000 pieces.3 nanometer capacity has increased simultaneously to 140,000 pieces, of which 20,000 pieces of production capacity will be available.
Apple is undoubtedly the largest customer of TSMC. Last year, the proportion of TSMCs revenue was as high as 25%.Apple will also become the first customer of TSMC 2nm. It is reported that all the production capacity of the early staged 2 -nanometer has been included in the production of M5 chips. New products.
In addition to MacBook Pro laptop, well -known analyst Guo Mingzheng recently said that in 2025, the iPhone 17 processor (code A19) will still use TSMC N3P (second -generation 3mm) Process; The processor of the iPhone 18 in 2026 will adopt a 2 -nanometer process, but based on cost considerations, at that time, the processors of the full series of iPhone 18 may use 2 nanometers.
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