On February 21, local time, US Secretary of Commerce, Raimondo, attended the first "Ifs Direct Connect in IntelDuring the event, it is said that it is necessary to continue to invest in the US semiconductor industry. It may launch "Chips 2" to re -gain global leadership and meet the demand for artificial intelligence (AI) processors.
"I doubt that if we want to lead the world, we must continue to invest -whether it is called" Chips 2 "or anything else." Raymond Doro said.
Raymond mostly emphasized the importance of the semiconductor industry in his speech, especially considering the increasing computing needs of artificial intelligence technology.She quoted her discussion with OPENAI CEO Sam Altman, who was seeking support from the US government for his "core" plan.
Raymond Duo said that as the industry leaders predicted, the number of chips required for artificial intelligence applications was amazing.At the same time, the excess of artificial intelligence processors will enable more enterprises to use artificial intelligence, which will become a competitive advantage in the United States.
In August 2022, US President Biden officially signed the Chips and Science Act of 2022 in the White House, referred to as the "Chips Act or Chip Act").It makes it a bill for formal effect.The bill will provide about US $ 52.7 billion in government subsidies for semiconductor production and research in the United States, and provide more than $ 200 billion in funds to stimulate the innovation and development of other American science and technology fields to enhance the competitiveness of the United States in the field of science and technology.
Among this $ 52.7 billion subsidy fund, 39 billion US dollars of direct subsidy funds will be used to subsidize chip manufacturing, of which 37 billion U.S. dollars will be used for subsidiesThe construction of advanced process wafers to promote the economic and national security interests of the United States.In addition, the U.S. government will also provide support for related chip manufacturers with $ 75 billion in loans and loan guarantee support.
Although the 39 billion US dollars of subsidies provided by the "Chip and Science Act" seems to be a lot of subsidies provided by the chip manufacturing industry, in fact, the construction cost of a cutting -edge process wafer fab is currently already already in the construction cost.More than $ 20 billion, not to mention the plans of many semiconductor manufacturers such as Intel, TSMC, Samsung, Gexin, Meiguang, Global Wile to invest in a factory in the United States, and will undoubtedly have a situation of "more monks and less porridge".
After more than a year of review, the US Department of Commerce has begun to issue subsidy funds to many applicants.U.S. subsidiaries, Microchip, and core.
On December 11, 2023, the Bayeng government of the United States announced that the US defense contractor BAE SYSTEMS will get a first federal that aims to support the new plan of key US semiconductor manufacturingThe amount of money is about $ 35 million.The BAE Systems will use the $ 35 million in funding to make its domestic F-15 and F-35 fighters and satellites and other defense systems.This subsidy is designed to help ensure that it is more securely supplying components that are crucial to the United States and its allies.
On January 5, 2024, the US Department of Commerce stated that it plans to issue $ 162 million in government subsidy funds to the US Microchip Technology to increase the companys chips and micro -micro -micro -micro -microOutput of controller (MCU).These funds will increase the output of semiconductors and MCUs in Microchip in the United States.
On February 20, 2024, Gexin announced that the US Department of Commerce has provided a direct subsidy funds of $ 1.5 billion according to the US "Chip and Science Act".In addition, the company will also receive more than $ 600 million in New York State in the next 10 years to help it develop and modernize.Gexin said that it has formulated a $ 12 billion investment plan for its US manufacturing base in the next 10 years, which is expected to help it meet the growing demand for domestic chips and create more than 1,500 manufacturing jobs and about 9,000 construction industriesemployment position.
Recently, according to Bloombergs report, unknown sources reported that the Bayeon government in the United States is negotiating with Intel or will provide Intel with more than $ 10 billion subsidies. This will be expected to become the United States.Promoting the largest subsidy of semiconductor local production plans so far.Intel has previously applied to the $ 20 billion to expand the Arizona wafer fab, invest in US $ 3.5 billion to upgrade the New Mexican factory, and invest in a large wafer factories at $ 20 billion in Ohio.", It is expected that the new plant is expected to become the worlds largest chip factory.However, due to the slowdown of the chip market and the slow investment in federal funds, the completion of the Intel Ohio factory has been postponed to 2026.
From the information that has now been exposed, BAE Systems, Microchip, Gexin and Intel chip manufacturers will total a total of $ 11.697 billion in "Chip and Science Act" of $ 11.697 billionSubsidy funds.In other words, only about $ 27.3 billion in chip manufacturing subsidies for $ 39 billion.
You must know that the subsidies of many large semiconductor manufacturers such as TSMC, Samsung and Micron have not yet been announced.
Among them, TSMCs investment in the Arizonian wafer fab in the United States is as high as US $ 40 billion, second only to Intels new wafer plant in the United States, if Intel can be able toTo get a subsidy of $ 10 billion, in accordance with normal rules, TSMC is also expected to get subsidies of nearly $ 10 billion.
Samsung has also invested $ 17 billion before building a 5nm wafer plant in Taylor, Texas.With reference to Intels investment and subsidy amount ratio, Samsung is expected to get nearly $ 5 billion subsidies.
Micron announced the $ 40 billion investment plan on the day of the "Chip and Science Act" in the United States.Storage chip manufacturing facility.Similarly, referring to Intels investment and subsidy ratio ratio, Micron is expected to receive subsidies of nearly $ 10 billion.
According to the above data, if the subsidies that the 7 manufacturers can get above the above 7 manufacturers will be removed, then the amount of chip manufacturing subsidies in the US "chip bill" may be$ 2.3 billion.
According to the news published by the US Department of Commerce on August 9, 2023 local time, when the US President Biden signed the "Chip and Science Act"More than 460 companies expressed their interest in the application of 52.7 billion US dollars of subsidy funds supported by the bill.An earlier information showed that as of May 2023, the US Department of Commerce had received more than 400 copy of the letter of subsidy application for the subsidy of chip projects.
Obviously, BAE Systems, Microchip, Gexin, and Intel chip manufacturers will total $ 11.697 billion in subsidies. TSMC, Samsung and Micron may receive them in totalObviously $ 39 billion subsidies for $ 23 billion are obviously not enough to subsidize more than 400 other semiconductor companies.
In other words, the four head manufacturers of Intel, TSMC, Samsung and Micron may take away subsidies of 35 billion US dollars (nearly 90%), and leftover.More than 400 companies applying for subsidies can only be divided into only 4 billion US dollars.
So, for the US government, how to solve the situation of this monk and less porridge?
Method 1: It can only reduce the subsidy standards that all enterprises can get, everyone can take less, so that everyone can divide a little.However, the big manufacturers may not agree.
For example, Intel, it signed an agreement with the German government last year to build a large -scale chip manufacturing base in Magdeburg, which will invest in more than 30 billion euros.About 10 billion euros subsidies; TSMC cooperated with Yingfei Ling, NXP Semiconductor, and Bosch to invest in semiconductor factories built at 10 billion euros in Dresden in eastern Germany. The German government will also provide about 5 billion euros subsidies;TSMCs first wafer fab has also received nearly half of the Japanese governments subsidy.
If the US government cannot provide sufficient subsidies to these large wafer manufacturing factories, it will cause related manufacturersinvest.
For example, Intel once retracted the foundation ceremony of its Ohio wafer factory.The uncertainty brought.Recently, Intel has postponed the mass production time of the Ohio wafers until 2026.
Last year, TSMC announced that the mass production plan of its 4nm wafer plant in Arizona will be postponed from 2024 to 2025.Earlier this year, TSMCs mass production time in Arizonas 3nm wafer fab was postponed from 2026 to 2027 or 2028.Although the official reason is the reason for the lack of skilled workers, the outside world speculation may also be affected by the slowdown of the US chip billing subsidy.
Although Global Worse announced on June 27, 2022, it was announced to invest $ 3 billion in a 12 -inch semiconductor silicon film factory in Shelman, Texas.However, Global Worse also said that the investment will depend on the US chip bill to provide subsidies for its factories.
Method 2: Start the "Chips 2" program that Raymond Duo said, that is, the second "chip bill" plan, raise more fundsThe US -Construction Factory or expanded semiconductor manufacturers subsidize.
Of course, this plan may still take a long time to be signed by the US government, and the amount of funds that can be raised is unclear how much it can be.But re -"draw a big cake" can at least appease those semiconductor companies that may not get subsidies or can only get less subsidies.Let them continue to invest in the United States.
Edit: Xinzhixun-Ruruke Sword
