News ①: Changxin Storage plans to produce HBM memory to fill the vacancy of domestic memory products
The demand for high -bandwidth memory has risen sharply in recent years, especially with artificial intelligence (AI)The arrival of the upsurge has made this trend more obvious., SK Hynix and Micron are the three giants of the HBM market. They are currently developing new products, especially the next generation of technologies such as HBM4leading position.
According to relevant media reports, Changxin Storage (CXMT) plans to produce HBM memory. It is purchasing the necessary equipment and has obtained devices for HBM memory assembly and testing.
At present, the mainstream HBM3 on the market is 8 or 12 layers of vertical stack, interconnect through the silicon hole (TSV) in the middle, and then put it onOn a basic logical chip, a 1024 -bit interface is connected.Although it looks simple, it is not actually the case, and it is a complicated task to make HBM.The equipment produced is fundamentally different from the traditional memory equipment, and it must be tested during the production process, then packaged, and finally test the entire stack.Among them, a large number of tools and professional knowledge are required, but HBM products are better than all types of memory on the market in terms of bandwidth and energy efficiency.
Changxin Storage has operated a DRAM wafer plant near Hefei, and raised funds to build a second place. It will introduce more advanced technology to manufacture and encapsulate HBM memory.In addition, Changxin Storage has not developed its own HBM production and packaging technology, and it is not clear what type of HBM is. It is expected that related products will not be seen in the next one to two years.
Some domestic chip manufacturers also hope to integrate HBM with logic chips, similar to TSMC COWOS packaging, which also forces SMIC to develop more advanced packaging technology.
Original link: https://www.expreview.com/92198.html
The echelon is also the only domestic DRAM manufacturer who has entered the consumer market. Its development is very noticeable.And Changxin has never been disappointing. In the era of the first DDR5 era, there were doubts that Changxins technical reserves came from the acquisition of Qimengda Company, and did not have DDR5 technology.He hit those peoples faces.Now, Changxin is ready to enter the new track and come to the field of HBM memory.As the most advanced branch in the memory field, HBM is the pearl in the crown of memory products, and it is also a must -have darling of the AI era computing card. It is obviously necessary to join this field.At present, HBM memory technology is firmly in the hands of Samsung, Micron, and SK Hynix. However, Changxin also broke through these three monopolies in the DRAM field. I do n’t know if it can be successfully broken through in the new field!
News ②: Jiang Bolongs first self -developed 2D MLC NAND flash memory release: capacity 32GB, bandwidth 400MB/s
According to UDN, TSMCs 2nm process has attracted a lot of customers interest. In addition to Apple, Intel also obtained the position of reserved supply, and may also enter TSMC 2nm customers.List.The rumors about Nova Lake first appeared in 2021. After that, I rarely heard the news of Nova Lake, and some even suspected that Intel had canceled the project.
It is rumored that Intel will have a lot of design for desktop platforms on the micro-architecture of Nova Lake.The processor, the target release time was in the second half of 2026.It can be equipped with up to 16 P-Core, 32 P-Core (codenamed "ARCTIC WOLF") and 4 LP E-Core. The last level cache of the high-end Core Ultra 9 is 180MB, while the Core Ultra 7 is the Core Ultra 7 is the time is the Core Ultra 7 is the time.144MB to cope with the AMD Zen 6 architecture and subsequent products.
It is reported that Nova Lake may be the largest structure in Intels history, even larger than when the first Core was in the original Core.Above, TSMC 2nm process may be one of the main sources of performance improvement.It was reported in the early days that Intel will enable the Intel 14/16A process on Nova Lake. In order to maintain the market competitiveness of the next generation of products, Intel may make determination to choose more mature semiconductor manufacturers.
Original link: https://www.ithome.com/0/748/245.htm
Dont mistake this information.Reading, in fact, Jiang Bolong is not a granules but packaging technology.Jiang Bolong is an old -fashioned NAND particle packaging manufacturer, and the 32GB 2D MLC NAND chip this time also supplements Jiang Bolongs gap in this field.The MLC particles with updated more modern packaging can be used on more modern products, so that those new products can also use MLC, a "durable flash memory", which is some years old.After all, more and more electronic products are now using QLC. Everyone does not want to use mobile phone tablets and other devices in the future without “planning scrap” to write the life directly?
News ③: Longxin 3C6000 server chip is officially delivered: use dragon chain technology, relative to the previous generation 3C5000 greatly improved
According to investors published by the official website of Longxin Zhongke, investorsRelational activity record table, Longxin 3C6000 has been delivered to the streaming film.
Longxin Zhongke mentioned that the IO interface of the Longxin 3C6000 chip has been greatly improved and optimized compared to the current server product 3C5000., Solve the bottleneck of the number of processor nucleus expansion. In the future, the companys server will be sealed into 32 -core and 64 -core products on the basis of 3C6000.
According to the IT home, the Longxin 3C6000 uses a single silicon 16-core 32 thread, the general processing performance is doubled, the memory is adopted, and the memory is adopted.DDR4-3200 × 4, supports the LS3D6000 dual silicon wafer 32 core 64 thread, LS3E6000 quadrilateral 64 core 128 thread, supports GPGPU and various accelerator extensions.
Original link: https://m.ithome.com/html/748697.htm
Before the new year, we just talked about Longxin3A6000 and ASUS -collaborated Board U Kit will immediately have the news of higher positioning products 3C6000 in the contemporary generation.At present, the 3C6000 has been officially filled. Its single chip will have 16 physical cores, which is not the same as the previous 3C5000 and 3C5000L.A single DIE 16 core means that there is a higher potential and stronger performance. Longxin said that in the future, it will develop 32 and 64 -core products on this basis.As a new attempt for multi -DIE design of the Chiclet architecture, Longxin will introduce the updated "Dragon Chain" technology, which should be a multi -DIE series bus technology similar to the AMD IF bus.There are no more news yet, but it has been improved a lot from the hard specifications alone. I look forward to the performance of Longxin!
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